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IC Package MicroSIP

IC Package MicroSIP

grabcad

A IC embedded inside an FR-4 laminate substrate (Printed Circuit Board), with a power inductor mounted on top of the substrate material. Socalled MicroSiP package which resemble a typical 8-pin DFN package. 3,5mm x 3,5mm x 1,75mm This model is a simple switcher module, an step-down DCDC converter.

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