Injection mould

Injection mould

grabcad

Injection mould design for a Raspberry Pi minicomputer case. In the first stage, a device housing consisting of two parts was designed. Only the upper part was selected for the mould design and an injection analysis was carried out for this part using Autodesk MoldFlow software. In the next step, the die and the punch were designed. The final step was to place the fabricated parts in the die plate and the punch plate respectively using an H7 fit.

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