Mounting Plate Frame for 8x8 LED Module Array Matrix

thingiverse

This design provides for mounting multiple 8x8 LED array modules. The design is configurable for the number of LED arrays in the horizontal and vertical directions, so it can be tailored for a range of applications. The frame is no larger than the LED arrays mounted to it; this allows zip ties or other mechanical fasteners to be used to join multiple frames for a display larger than can be printed at one time. The driver chips on the circuit boards for the LED arrays typically use a Maxim MAX7219 or MAX7221, or AMS AS1106 or AS1107. Boards with driver chips in a SOIC package can be sized to match the 8x8 LED matrices. Boards with driver chips in a DIP package are larger, with the DIP driver chip located outside the LED matrix. The original design was developed for use with "LED Matrix Link v2.0" available at https://oshpark.com/shared_projects/J1PUJCGP. The v2.0 board is an adaptation of the LED Matrix Link board available from https://friedcircuits.us/. I liked the friedcircuits approach since it puts the SOIC driver chip on the side of the board away from the LED module, improving its ability to dissipate any generated heat. The friedcircuits approach also allows right-angle headers to be used to interconnect LED modules. My v2.0 revision was driven by a preference for through-hole capacitors and resistor, and a desire to beef up trace widths - especially for the trace handling 5V power daisy chained for multiple modules. I also trimmed the board dimensions a bit, adjusted placements of the four mounting holes to provide more room for screw heads, and added silkscreen for a serial number label. The rev A version of the openSCAD script adds flexibility in handling multiple types of module boards. In addition to the original v2.0 Matrix Link, sample dimension data is provided in the openSCAD file for the Friedcircuits Matrix Link v1.2, generic boards marked as FC-16 type, and the larger generic boards using DIP-style MAX7219 driver chips located outside the LED array. Selection of the desired board type is handled through commenting/uncommenting the appropriate dimension data. Sample STL files are provided for 3-by-2 configurations of the frame for the Matrix Link v2.0, Friedcircuits Matrix Link v1.2, and FC-16 type driver boards. The sample STL file for the DIP-style MAX7219 is provided in a 3-by-1 configuration. All have mounting holes sizes for threading M2.5 hardware. The openSCAD file has been extensively commented for those wishing to tailor the design. Print Settings Printer Brand: RepRap Printer: MakerFarm i3v Rafts: No Supports: No Resolution: 0.2mm Infill: 20% or as desired Notes: Hole dimension for threading M2.5 hardware was tested with Simplify3D as the slicer, set to print inside perimeters first. Post-Printing If there are burrs on the edges of the circuit boards used, file or sand them away so that adjacent boards can fit tightly together. Use of mounting hardware to attach the boards to the printed frame means that the LED arrays cannot be directly soldered to the boards. Single Inline Package (SIP) sockets should be soldered to the boards, and the LED arrays inserted into the SIP sockets.