ODROID C1 breakout frame for MLAB

thingiverse

3D Printable Breakout frame which mechanically adopts the ODROID-C1 to MLAB (http://wiki.mlab.cz/) electronic prototyping and development system. The design even provides great increase of mechanical durability of weak ODROID's PCB board. The breakout frame accepts standard M3x12mm screws and nuts which are used normally in MLAB system. Instructions The breakout frame is designed to be easily printable on almost all 3D FDM printers, it can be printed from ABS or PLA plastic with superb results. But an inspection of trace placement in thin walls is required after slicing. The model has bottom holes for nuts covered by one layer of material. This technological material allows slicing software to plan a bridge over all holes. The bridge layer must be drilled of after printing by a 3mm drill. Hexagonal nuts should be inserted from bottom side to the prepared holes. M3x12mm screws for mount mounting ODROID board should be screwed from the top side. Other file formats and thing up to date source codes are freely available from MLAB's SVN Repository.