WIMUv4 Packagaing from OpenSCAD Parametric Packaging Script v2

thingiverse

WIMU v4 Packaging Script This variant of OpenSCAD Parametric Packaging Script v2 is used for producing a prototype production packaging for WIMU v4 devices. The author is Mark Gaffney, version 2.6L, released on November 4th, 2013. To-do list includes fixing internal radii and no-of-sides when using chamfered packages to maintain wall thickness. A warning has been issued that some combinations of values, shapes, and locations may lead to an invalid or non-manifold shape, preventing the creation of a valid .stl file. This thing uses HarlanDMii's "write.scad" module, which you need to download and place in the correct directory to run on your PC. When generating a stacked layout, it may appear that the top is taller than it should be, but this is a visualization bug in OpenSCAD; the resulting .STL will be perfect. The current variant (2013) features changes such as adjustments to interlocking features for better bite on edges with large cutouts for the switch and USB, moved and enlarged USB and switch holes, added text for indicating switch status, holes and guides for internal reset/bootloader-enable switches, and a hole for a screw-in screwpost. The packaging is designed for WIMU v4 (2013 version) with a small battery, the same size as WIMU v3a and v3. A bug fix was implemented to address interlocking feature generation issues when the top_bottom_ratio wasn't 0.5, tested only on spheroids. For more information about previous versions, please refer to the ancestor of this thing at http://www.thingiverse.com/thing:66030. The software is copyrighted by Tyndall National Institute with provisions for use, copying, modifying, and distributing under specific conditions as stated in the copyright notice. No support or comments will be provided on this object; please reach out to the parent object (http://www.thingiverse.com/thing:66030) instead. Feel free to download, read, and play with the code.